Computing Products
Server-grade Intel® Xeon® D-2800/D-2700 Processor (Eddy Lake D) High-performance Storage Server System, DC 16V to 50V, 2 10G SFP+ LAN, 4 GigE LAN, 4 USB, 4 COM RS-232/422/485, 1 PCIe x2, 10 U.2 Tray, 2 SSD Tray, 16 Isolated DIO, High Performance, Flexible, Expandable
Server-grade Intel® Xeon® D-2800/D-2700 Processor (Eddy Lake D) Expandable GPU-accelerated System with Discrete Graphics, DC 16V to 50V/AC 220V, 2 10G SFP+ LAN, 4 GigE LAN, 4 USB, 4 COM RS-232/422/485, 1 Nano SIM, Max 6 PCIe Slot, 2 M.2, 16 Isolated DIO, High Performance, Flexible, Expandable
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S), Expandable GPU-accelerated System with Discrete Graphics, 2 2.5GigE LAN, 4 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 4 COM RS-232/422/485, 3 SIM, 2 Front-access 2.5" SSD/HDD Tray, 2 Front-access M.2 SSD Tray, 5 PCIe Slot, 3 M.2, 32 Isolated DIO, DC Power Input, High Performance, Flexible, Expandable
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S), Expandable GPU-accelerated System with Discrete Graphics, 2 2.5GigE LAN, 4 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 4 COM RS-232/422/485, 3 SIM, 2 Front-access 2.5" SSD/HDD Tray, 2 Front-access M.2 SSD Tray, 5 PCIe Slot, 3 M.2, 32 Isolated DIO, AC Power Input, High Performance, Flexible, Expandable
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S), Expandable GPU-accelerated System with Discrete Graphics, 2 2.5 LAN, 4 USB 3.2 Gen 2, 1 USB 3.2 Gen 2x2 Type-C, 4 COM RS-232/422/485, 3 SIM, 2 Front-access 2.5" SSD/HDD Tray, 2 Front-access M.2 SSD Tray, 3 PCIe Slot, 3 M.2, 32 Isolated DIO, DC Power Input, High Performance, Flexible, Expandable
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Workstation-grade Fanless Embedded System with compact Hailo-8™ AI accelerator, max 5 2.5G LAN with 4 PoE+, 4 Front-access M.2 SSD Tray, DC 9V to 50V, High Performance, Rugged, -40°C to 65°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Flexible AI Computing Workstation, 4 2.5G PoE+ LAN, 2 GigE LAN, 4 front-access SSD trays, 4 PCIe slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, -20°C to 45°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Flexible AI Computing Workstation, 4 2.5G PoE+ LAN, 2 GigE LAN, 4 front-access SSD trays, 3 PCIe slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, -20°C to 45°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Flexible AI Computing Workstation, 4 2.5G PoE+, 2 GigE LAN, 4 front-access SSD trays, 2 PCIe slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, -20°C to 45°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Flexible AI Computing Workstation, 4 M12 2.5G PoE+ LAN, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, -20°C to 45°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Flexible AI Computing Workstation, 4 2.5G PoE+ LAN, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, -20°C to 45°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Flexible AI Computing Workstation, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, -20°C to 45°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) In-Vehicle Computing Workstation, 16V to 160V DC Power Input with 4kV DC Isolation, up to 500V Surge Protection, 8 Independent 2.5GigE LAN M12 X-coded with 4 IEEE 802.3at PoE+, 1 2.5GigE LAN, 1 GigE LAN, 4 Isolated COM, up to 6 front-access 7mm to 15mm height SSD/HDD Tray, UPS supported
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) In-Vehicle Computing Workstation, 16V to 160V DC Power Input with 4kV DC Isolation, up to 500V Surge Protection, 8 Independent 2.5GigE LAN M12 X-coded with 4 IEEE 802.3at PoE+, 1 2.5GigE LAN, 1 GigE LAN, 4 Isolated COM, 2 Front-access 2.5"SSD/HDD Tray
8th Gen Intel® Core™ U-series Processor (Whiskey Lake) Ultra-slim Fanless Edge AI Computing System with compact Hailo-8™ AI accelerator, 4 GigE LAN with 2 PoE+, 2 DDR4, 4 USB 3.1, 4 COM RS-232/422/485, 16 Isolated DIO, 1 Mini PCIe, 3 M.2, Fanless, Expandable, 0°C to 60°C
Workstation-grade Intel® Xeon®/Core™ i9/i7/i5/i3 (Comet Lake) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 (Comet Lake) AI Computing System with Independent AI accelerators
Workstation-grade Intel® Xeon®/Core™ i9/i7/i5/i3 (Comet Lake) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics
10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) GPU Computing System with optional Fan Sink, 6 GigE LAN with 4 PoE+, 2 Front-access M.2 Trays, 2 Front-access SSD/HDD Trays, 1 PCIe x16, 1 PCIe x4, 4 M.2, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
10th Gen Intel® Core™ i9/i7/i5/i3 Processor (Comet Lake) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce®/AMD Radeon™ Graphics
Workstation-grade Intel® Xeon®/Core™ i9/i7/i5/i3 (Comet Lake) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics
10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) GPU Computing System with optional Fan Sink, 6 GigE LAN with 4 PoE+, 2 Front-access M.2 Trays, 2 Front-access SSD/HDD Trays, 1 PCIe x16, 1 PCIe x4, 4 M.2, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 (Comet Lake) AI Computing System with Independent AI accelerators
Workstation-grade Intel® Xeon®/Core™ i9/i7/i5/i3 (Comet Lake) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics
10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) GPU Computing System with optional Fan Sink, 6 GigE LAN with 4 PoE+, 2 Front-access M.2 Trays, 2 Front-access SSD/HDD Trays, 1 PCIe x16, 1 PCIe x4, 4 M.2, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 4 front-access SSD trays, 1 PCIe x16 slot, 1 PCIe x4, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 32 Isolated DIO, High-Performance, Rugged, Extended Temperature
Workstation-grade 10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (CML) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, 2 GigE LAN, 2 front-access SSD trays, 1 PCIe x16 slot, 3 Nano SIM, 6 USB 3.2, 4 COM RS-232/422/485, M.2 Key B, M.2 Key E, M.2 Key M, 16 GPIO, High-Performance, Rugged, Extended Temperature
Quad Core Intel® Xeon®/Core™ i7/i5 Processor (Skylake-H) AI Computing System with Intel® CM236 & NVIDIA® Tesla®/Quadro®/GeForce®/AMD Radeon™ Graphics, 6 GigE LAN with 4 PoE+, 2 Front-access SSD Tray, 4 SIM, 6 USB 3.0, 4 COM, 32 Isolated DIO, 2 SUMIT Slots, High Performance, Independent Graphics, EN50155, EN50121
Quad Core Intel® Xeon®/Core™ i7/i5 Processor (Skylake-H) AI Computing System with Intel® CM236 & NVIDIA® Tesla®/Quadro®/GeForce®/AMD Radeon™ Graphics, 6 GigE LAN with 4 PoE+, 2 Front-access SSD Tray, 4 SIM, 6 USB 3.0, 4 COM, 32 Isolated DIO, 2 SUMIT Slots, High Performance, Independent Graphics, EN50155, EN50121
Workstation-grade 9th Generation Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Dual GPU AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® or AMD Radeon™ Graphics, NVIDIA Turing™ architecture, 9V to 55V DC-in, 4 GigE LAN, 4 10G USB 3.1, 4 COM RS-232/422/485, 1 SIM, 4 PCIe Slot, 16 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th/8th Generation Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake Refresh) Dual GPU AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® or AMD Radeon™ Graphics, NVIDIA Turing™ architecture, 12V to 55V DC-in, 4 M12 LAN, 4 M12 COM, 2 M12 CAN Bus, 2 SIM, 4 PCIe Slot, High Performance, Flexible, Expandable
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Expandable GPU Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® graphics, NVIDIA Turing/Pascal architecture, 7 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1 Gen 2, 4 COM RS-232/422/485, 2 SIM, 2 PCI/PCIe Slot, M.2, 32 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Expandable GPU Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® graphics, NVIDIA Turing/Pascal architecture, 7 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1 Gen 2, 4 COM RS-232/422/485, 2 SIM, 4 Front-access 2.5" SSD/HDD Tray, 2 PCI/PCIe Slot, M.2, 32 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake Refresh) AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® graphics NVIDIA Turing™ architecture, 7 displays, 8K resolution, 6 GigE LAN, 4 PoE+, 6 10G USB 3.1, 4 COM RS-232/422/485, 3 SIM, 4 Front-access 2.5" SSD Tray, 2 Mini PCIe/mSATA, M.2, 32 Isolated DIO, High Performance, Flexible
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake Refresh) AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® graphics NVIDIA Turing™ architecture, 7 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1, 4 COM RS-232/422/485, 3 SIM, 4 Front-access 2.5" SSD Tray, 2 Mini PCIe/mSATA, M.2, 16 GPIO, High Performance, Flexible
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake Refresh) AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® graphics NVIDIA Turing™ architecture, 7 displays, 8K resolution, 6 GigE LAN, 4 PoE+, 6 10G USB 3.1, 4 COM RS-232/422/485, 3 SIM, 4 Front-access 2.5" SSD Tray, 2 Mini PCIe/mSATA, M.2, 32 Isolated DIO, High Performance, Flexible
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake Refresh) AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® graphics NVIDIA Turing™ architecture, 7 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1, 4 COM RS-232/422/485, 3 SIM, 4 Front-access 2.5" SSD Tray, 2 Mini PCIe/mSATA, M.2, 16 GPIO, High Performance, Flexible
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Dual GPU AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® Graphics Card, NVIDIA Turing™ architecture, 11 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1 Gen 2, 4 Front-access 2.5" SSD/HDD Tray, 4 PCIe Slot, 3 COM RS-232/422/485, 2 SIM, 2 M.2, 32 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Dual GPU AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® Graphics Card, NVIDIA Turing™ architecture, 11 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1 Gen 2, 4 PCIe Slot, 3 COM RS-232/422/485, 2 SIM, 2 M.2, 32 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Dual GPU AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® Graphics Card, NVIDIA Turing™ architecture, 11 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1 Gen 2, 4 Front-access 2.5" SSD/HDD Tray, 3 COM RS-232/422/485, 2 SIM, 2 M.2, 32 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 processor (Coffee Lake) Dual GPU AI Computing System with Intel® C246 & NVIDIA® Tesla®/Quadro®/GeForce® Graphics Card, NVIDIA Turing™ architecture, 11 displays, 8K resolution, 2 GigE LAN, 6 10G USB 3.1 Gen 2, 3 COM RS-232/422/485, 2 SIM, 2 M.2, 32 Isolated DIO, High Performance, Flexible, Expandable
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake Refresh) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, NVIDIA Turing/Pascal architecture, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 6 USB 3.1, 3 SIM, 4 COM RS-232/422/485, 32 Isolated DIO, high-performance, Independent Graphics
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake Refresh) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, NVIDIA Turing/Pascal architecture, 2 GigE LAN, 2 front-access SSD trays, 6 USB 3.1, 3 SIM, 4 COM RS-232/422/485, 16 GPIO, high-performance, Independent Graphics
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake Refresh) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, NVIDIA Turing/Pascal architecture, 6 GigE LAN with 4 PoE+, 2 front-access SSD trays, 6 USB 3.1, 3 SIM, 4 COM RS-232/422/485, 32 Isolated DIO, high-performance, Independent Graphics
Workstation-grade 9th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake Refresh) AI Computing System with NVIDIA® Tesla®/Quadro®/GeForce® Graphics, NVIDIA Turing/Pascal architecture, 2 GigE LAN, 2 front-access SSD trays, 6 USB 3.1, 3 SIM, 4 COM RS-232/422/485, 16 GPIO, high-performance, Independent Graphics
Workstation-grade 7th generation Intel® Xeon®/Core™ i7/i5/i3 Fanless GPU Computing System with Intel® C236 chipset & compact NVIDIA® Quadro® MXM Module, NVIDIA® Turing™ architecture, up to 7 independent HD display, all-in-one, 6 USB 3.0, 4 COM, 3 SIM, 2 Front-access 2.5" SSD/HDD trays, 1 PCI/PCIe slot, 32 Isolated DIO, high performance, flexible, independent graphics, expandable
Workstation-grade 7th Generation Intel® Xeon®/Core™ i7/i5/i3 GPU Computing System with Intel® C236 & compact NVIDIA® Quadro® MXM GPU Module, NVIDIA® Turing™ architecture, 7 independent HD displays, all-in-one, 6 USB 3.0, 3 COM, 3 SIM, 2 Front-access 2.5" SSD/HDD Tray, 1 PCI/PCIe Slot, 32 Isolated DIO, High Performance, Flexible, Independent Graphics, Expandable
Quad Core Intel® Xeon®/Core™ i7/i5/i3 (Kaby Lake/Skylake) AI Computing System with Intel® C236 & NVIDIA Tesla®/Quadro®/GeForce®/AMD Radeon™, NVIDIA Turing/Pascal architecture, 6 GigE LAN with 4 PoE+, 2 Front-access SSD Tray, 8 USB 3.0, M.2 Socket, 3 SIM, 4 COM, 32 Isolated DIO, High Performance
Quad Core Intel® Xeon®/Core™ i7/i5/i3 (Kaby Lake/Skylake) AI Computing System with Intel® C236 & NVIDIA Tesla®/Quadro®/GeForce®/AMD Radeon™, NVIDIA Turing/Pascal architecture, 2 GigE LAN, 2 Front-access SSD Tray, 8 USB 3.0, M.2 Socket, 3 SIM, 4 COM, 16 GPIO, High Performance
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S), IP66 Rating High Performance Military Computer, Rugged MIL-DTL-38999 Connector for 6 USB 2.0, 4 GigE RJ45, 4 COM RS 232/422/485 , 1 DVI-I, 1 Key M, 2 Front Access 2.5" SSD Tray, DC 12V to 50V, High-Performance, Rugged, Fanless, -40℃ to 65℃ Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th Gen) Compact Embedded Computing System, 2 GigE LAN, 8 USB, DC 24V, High Performance, Fanless, Rugged, Compact, -25°C to 60°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th Gen) Compact Embedded Computing System, 2 GigE LAN, 8 USB, DC 24V, High Performance, Compact, -25°C to 75°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th Gen), Compact Embedded Computing System, 6 GigE LAN with 4 PoE+, 12 USB, 28 Isolated DIO, DC 24V, High Performance, Compact, -25°C to 75°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) In-Vehicle Computing Workstation, 16V to 160V DC Power Input with 4kV DC Isolation, up to 500V Surge Protection, 8 Independent 2.5GigE LAN M12 X-coded with 4 IEEE 802.3at PoE+, 1 2.5GigE LAN, 1 GigE LAN, 4 Isolated COM, up to 6 front-access 7mm to 15mm height SSD/HDD Tray, UPS supported
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) In-Vehicle Computing Workstation, 16V to 160V DC Power Input with 4kV DC Isolation, up to 500V Surge Protection, 8 Independent 2.5GigE LAN M12 X-coded with 4 IEEE 802.3at PoE+, 1 2.5GigE LAN, 1 GigE LAN, 4 Isolated COM, 2 Front-access 2.5"SSD/HDD Tray
AMD Ryzen™ PRO 5000 Series Processor (Cezanne) Embedded System
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Workstation-grade Fanless Embedded System with compact Hailo-8™ AI accelerator, max 5 2.5G LAN with 4 PoE+, 4 Front-access M.2 SSD Tray, DC 9V to 50V, High Performance, Rugged, -40°C to 65°C Extended Temperature
Intel® Core™ i9/i7/i5/i3 Processor (14th gen, RPL-S Refresh/RPL-S/ADL-S) Workstation-grade Fanless Embedded System, max 8 2.5G LAN with 4 PoE+, optional 2 10GigE LAN, 4 Front-access M.2 SSD Tray, DC 9V to 50V, High Performance, Rugged, -40°C to 75°C Extended Temperature
10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) Workstation-grade Fanless Embedded System, 9 GigE LAN with 3 2.5 GigE LAN and 4 PoE+, 2 Front-access SSD/HDD Tray, 3 M.2 Socket, Isolated DIO, 9V to 50V DC, High Performance, Rugged, -40°C to 75°C Extended Temperature, Azure Certified
9th/8th Gen Intel® Core™ i7/i5/i3 (Coffee Lake) with Intel® H310 Chipset, Fanless, 4 GigE LAN, 4 USB 3.1, 4 COM RS-232/422/485, 2 Mini PCIe, 9V to 36V DC Power Input, High Performance, Compact, -25°C to 60°C Operating Temperature
9th/8th Gen Intel® Core™ i7/i5/i3 (Coffee Lake) with Intel® H310 Chipset, Fanless, 4 GigE LAN, 4 USB 3.1, 4 COM RS-232/422/485, 2 Mini PCIe, 12V DC Power Input, High Performance, Compact, -25°C to 60°C Operating Temperature
9th Gen Intel® Xeon®/Core™ i7/i5/i3 Processor (Coffee Lake Refresh) Fanless Embedded System with Intel® C246 Chipset, 6 GigE LAN with 4 PoE+, 2 Front-access SSD Tray, 6 USB 3.1, 3 M.2, 3 SIM, SUMIT, Isolated DIO, Analog Input, Analog Output, High Performance, Rugged, 0°C to 70°C Extended Temperature
9th Gen Intel® Xeon®/Core™ i7/i5/i3 Processor (Coffee Lake Refresh) Fanless Embedded System with Intel® C246 Chipset, 2 GigE LAN, 2 Front-access SSD Tray, 6 USB 3.1, 3 M.2, 3 SIM, SUMIT, 16 GPIO, Analog Input, Analog Output, High Performance, Rugged, 0°C to 70°C Extended Temperature
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake) with Intel® C246 chipset, Fanless Embedded System, 9 GigE LAN with 4 PoE+, 2 Front-access SSD/HDD Tray, 2 M.2 Socket, up to 6 USB 3.1, Isolated DIO, High Performance, Rugged, -40°C to 75°C Extended Temperature
Take Your First Step!