ECX700-ADP

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  • Intel® Alder Lake-P Processor i5-1245UE/ i7-1265UE
  • Intel® Iris® Xe Graphic Performance
  • Extreme Ruggedized design to IEC 60068-2-64 & -20 ~ 70°C wide temperature
  • Rich I/O help integrators meet the demand for various applications
  • To fulfill wireless transmission, an external SIM slot reduces the difficulties to change SIMs, and the high gain antenna ensures the quality of the signal
  • Various applications: Industrial automation, Outdoor application
  • Waterproof & Dustproof design conforming to IP67

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Description

 

Fanless Embedded System, 12th Gen Intel® Core™, IP67/ IP69K, support smart vent, Wi-Fi / LTE, MIL-ST.

Wide-temp: -20~70°C    Wide Voltage: 9~36V DC-in     Fanless Design    HDMI      Rugged Design     IP67        

RoHS Certification    CE Certification      FCC Certification